Methods and apparatus for preparing power transmission cables

ABSTRACT

A method for preparing a polymer insulated cable including a semiconductive layer surrounding a polymeric insulation layer includes: cutting the semiconductive layer by grinding a circumferential dividing groove in the semiconductive layer using a rotating grinding surface, wherein the dividing groove defines first and second semiconductive sections of the semiconductive layer on opposed sides of the dividing groove; and thereafter removing the second semiconductive section from the polymeric insulation layer while retaining the first semiconductive section on the polymeric insulation layer.

RELATED APPLICATION(S)

The present application is a continuation of and claims priority fromU.S. patent application Ser. No. 14/622,216, filed Feb. 13, 2015, whichis a continuation of and claims priority from U.S. patent applicationSer. No. 13/298,915, filed Nov. 17, 2011, now U.S. Pat. No. 8,986,073,which claims the benefit of and priority from U.S. Provisional PatentApplication No. 61/529,065, filed Aug. 30, 2011, the disclosures ofwhich are incorporated herein by reference by their entireties.

FIELD OF THE INVENTION

The present invention relates to electrical cables and, moreparticularly, to the preparation of electrical power transmission cablesfor termination.

BACKGROUND OF THE INVENTION

Terminations for high voltage (i.e., greater than about 1 kV) polymericinsulated electrical transmission cables are typically accomplished bycutting back an outer polymeric jacket, neutral conductors, asemiconductive layer, and a primary polymeric insulation layer to exposea primary conductor, on which an electrical connector is installed. Theexposed components of the cable must be protected. For high voltagecables, such protection typically requires electrical stress control atthe termination and various stress control elements have been providedfor this purpose.

Two types of polymer insulated transmission cable in wide use areethylene propylene rubber (EPR) insulated cables and cross-linkedpolyethylene (XLPE) insulated cables. In each type of cable, a primaryconductor is surrounded by a layer of the insulation (EPR or XLPE),which is in turn surrounded by a semiconductive layer. Thesemiconductive layer is a layer of a polymer composite including anelectrically conductive material (e.g., polyethylene (PE) containingcarbon black).

The end of the cable's semiconductive layer is the electrically moststressed location within a cable accessory. Components provided byaccessory manufacturers are designed to reduce this stress to atolerable level. However, in order to achieve this, certain requirementsapply, which are difficult to meet with typically used cable preparationtools on EPR cables and their semiconductive layers. Namely, the regionof the transition should be void free (no air pockets) and smooth toallow the stress grading components to follow the cable surface closelyand provide sufficient interface pressure.

EPR cables usually have semiconductive layers that cannot be taken offusing cutting type cable strippers designed for bonded semiconductivelayers on XLPE cables. The semiconductive layers on EPR cables aretypically strippable after applying moderate heat to the semiconductivelayer (i.e., with a torch). Typical tools to define the end of thesemiconductive layer to be stripped are cutting blades and round files.Blades may cut too deeply or not deeply enough considering the typicalmanufacturing tolerances of semiconductive layers. Cutting too deep mayintroduce immediate air pockets within the cut. Not cutting deep enoughmay cause air pockets by lifting up the end of the semiconductive layerwhen stripping the other end. Round files offer the advantage ofproviding a kind of chamfer at the cut back and a visual indication whenthe right depth has been reached. However, due to the tangentialmovement of the file, the risk of lifting up the remaining thin end ofthe semiconductive layer remains.

To provide a smooth transition from the cable's semiconductive layer toits insulation, conductive paints are sometimes used. However, many suchpaints do not stick very well to EPR even though they stick quite wellto XLPE.

SUMMARY OF THE INVENTION

According to embodiments of the present invention, a method forpreparing a polymer insulated cable including a semiconductive layersurrounding a polymeric insulation layer includes: cutting thesemiconductive layer by grinding a circumferential dividing groove inthe semiconductive layer using a rotating grinding surface, wherein thedividing groove defines first and second semiconductive sections of thesemiconductive layer on opposed sides of the dividing groove; andthereafter removing the second semiconductive section from the polymericinsulation layer while retaining the first semiconductive section on thepolymeric insulation layer.

According to method embodiments of the present invention, a method forpreparing a polymer insulated cable including a semiconductive layersurrounding a polymeric insulation layer includes: providing a cuttingtool including a driver and a grinding surface; releasably coupling thedriver and the grinding surface to the cable using a mounting tool;thereafter cutting the semiconductive layer by grinding acircumferential dividing groove in the semiconductive layer using thegrinding surface, wherein the dividing groove defines first and secondsemiconductive sections of the semiconductive layer on opposed sides ofthe dividing groove; and thereafter removing the second semiconductivesection from the polymeric insulation layer while retaining the firstsemiconductive section on the polymeric insulation layer.

According to embodiments of the present invention, an apparatus forpreparing a polymer insulated cable including a semiconductive layersurrounding a polymeric insulation layer includes a cutting tool and amounting tool. The cutting tool includes a driver and a grindingsurface. The mounting tool is configured to releasably couple thecutting tool to the cable such that the grinding surface engages thesemiconductive layer and can be used to grind a circumferential dividinggroove in the semiconductive layer. The dividing groove defines firstand second semiconductive sections of the semiconductive layer onopposed sides of the dividing groove.

According to embodiments of the present invention, a method forpreparing a polymer insulated cable includes: applying an electricallyconductive paint composition to the polymer insulated cable. Theelectrically conductive paint composition includes an electricallyconductive material mixed with a cyanoacrylate.

According to method embodiments of the present invention, a method forpreparing a polymer insulated cable includes applying an electricallyconductive paint composition to the polymer insulated cable. Theelectrically conductive paint composition includes an electricallyconductive paint mixed with a glue. The electrically conductive paintincludes a carrier and an electrically conductive material.

According to further embodiments of the present invention, anelectrically conductive paint composition includes an electricallyconductive material mixed with a cyanoacrylate.

According to embodiments of the present invention, an electricallyconductive paint composition includes an electrically conductive paintmixed with a glue. The electrically conductive paint includes a carrierand an electrically conductive material.

Further features, advantages and details of the present invention willbe appreciated by those of ordinary skill in the art from a reading ofthe figures and the detailed description of the preferred embodimentsthat follow, such description being merely illustrative of the presentinvention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is perspective view of a polymer insulated cable for use withmethods and apparatus according to embodiments of the present invention.

FIG. 2 is a rear, top perspective view of a cutting apparatus accordingto embodiments of the present invention on the cable of FIG. 1.

FIG. 3 is a rear, bottom perspective view of the cutting apparatus ofFIG. 2 mounted on the cable.

FIG. 4 is a side view of the cutting apparatus of FIG. 2 mounted on thecable.

FIG. 5 is a top view of the cutting apparatus of FIG. 2 mounted on thecable.

FIG. 6 is an enlarged perspective view of a grinding bit forming a partof the cutting apparatus of FIG. 2.

FIG. 7 is an enlarged, fragmentary, cross-sectional view of the cableand the grinding apparatus of FIG. 2 wherein the grinding bit has formeda partial groove in a semiconductive layer of the cable.

FIGS. 8-14 illustrate methods for preparing the cable according toembodiments of the present invention.

FIG. 15 is a perspective view of a conductive paint system according toembodiments of the present invention.

DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION

The present invention now will be described more fully hereinafter withreference to the accompanying drawings, in which illustrativeembodiments of the invention are shown. In the drawings, the relativesizes of regions or features may be exaggerated for clarity. Thisinvention may, however, be embodied in many different forms and shouldnot be construed as limited to the embodiments set forth herein; rather,these embodiments are provided so that this disclosure will be thoroughand complete, and will fully convey the scope of the invention to thoseskilled in the art.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various elements, components, regions, layersand/or sections, these elements, components, regions, layers and/orsections should not be limited by these terms. These terms are only usedto distinguish one element, component, region, layer or section fromanother region, layer or section. Thus, a first element, component,region, layer or section discussed below could be termed a secondelement, component, region, layer or section without departing from theteachings of the present invention.

Spatially relative terms, such as “beneath”, “below”, “lower”, “above”,“upper” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the exemplary term “below” can encompass both anorientation of above and below. The device may be otherwise oriented(rotated 90° or at other orientations) and the spatially relativedescriptors used herein interpreted accordingly.

As used herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless expressly stated otherwise. Itwill be further understood that the terms “includes,” “comprises,”“including” and/or “comprising,” when used in this specification,specify the presence of stated features, integers, steps, operations,elements, and/or components, but do not preclude the presence oraddition of one or more other features, integers, steps, operations,elements, components, and/or groups thereof. It will be understood thatwhen an element is referred to as being “connected” or “coupled” toanother element, it can be directly connected or coupled to the otherelement or intervening elements may be present. As used herein, the term“and/or” includes any and all combinations of one or more of theassociated listed items.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this invention belongs. It will befurther understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of this specification andthe relevant art and will not be interpreted in an idealized or overlyformal sense unless expressly so defined herein.

Systems, methods and apparatus according to embodiments of the presentinvention can be used to prepare a polymer insulated cable for properinstallation of a cable accessory or accessories, such as an electricalstress control element. According to some embodiments, the inventivesystems, methods and apparatus are used to prepare an EPR insulatedcable, and aspects of the methods and apparatus may be particularlybeneficial when used with EPR cables. However, it will be appreciatedthat some embodiments and aspects of the invention may be employed toprepare other types of polymer insulated cables such as XLPE insulatedcables.

An exemplary polymer insulated electrical power transmission cable 20for use with the systems, methods and apparatus of the present inventionis shown in FIG. 1. The polymeric cable 20 includes a primary electricalconductor 22, a primary polymeric conductor insulation layer 24, asemiconductive layer 30, one or more neutral conductors 26, and a jacket28, with each component being concentrically surrounded by the next.According to some embodiments and as shown, the neutral conductors 26are individual wires, which may be helically wound about thesemiconductive layer 30. The cable 20 has a lengthwise axis A-A. Theprimary conductor 22 may be formed of any suitable electricallyconductive materials such as copper (solid or stranded). The polymericinsulation layer 24 may be formed of any suitable electricallyinsulative material such as crosslinked polyethylene (XLPE) or ethylenepropylene rubber EPR. The semiconductive layer 30 may be formed of anysuitable semiconductor material such as carbon black with PE. Theneutral conductors 26 may be formed of any suitable material such ascopper. The jacket 28 may be formed of any suitable material such as PVCor PE. However, it will be appreciated that polymeric cables of othertypes and configurations may be used.

According to some embodiments, the semiconductive layer 30 has athickness T1 (FIG. 7) in the range of from about 0.8 mm to 1.5 mm and,according to some embodiments, in the range of from about 0.5 mm to 2.5mm.

The cable 20, once prepared, may be terminated (e.g., terminated orspliced to another cable) and covered in any desired manner and suitablemethods and cable accessories are known to those of skill in the art. Aconnector 30 (FIG. 14), for example, may be mounted on the conductor 22and a stress relief cone 60, for example, may be installed about cable.

The connector 30 is electrically conductive and may include a crimp-typeor bolt-type connector, for example. The connector 30 may be formed ofcopper or aluminum, for example.

The illustrated stress relief cone 60 (FIG. 14) includes a tubular,electrically conductive deflector 62, surrounded by a tubularelectrically insulating body 64 and an electrically insulating cover 66.The deflector 62 may be formed of conductive silicone rubber, forexample. The insulating body 64 may be formed of an elastomer such assilicone rubber or EPDM, for example. The cover 66 may be formed of anelastomer such as silicone rubber, for example. Other types andconfigurations of stress relief tubes and other cable accessories may beused.

The illustrative cable preparation system includes a cutting apparatus100 (FIGS. 2-7) and a conductive paint system 180 (FIG. 15). The cuttingapparatus 100 is used to assist in removing a section of thesemiconductive layer 30 and the paint system 180 is used to extend theeffective semiconductor layer on the prepared cable. While the cuttingapparatus 100 and the paint system 180 are described hereinbelow asbeing used together, according to other embodiments, the cuttingapparatus 100 and the paint system 180 may be used independently of oneanother. For example, the semiconductive layer 30 may be severed using adifferent technique or apparatus, or the semiconductive layer 30 may becut using the apparatus 100 but left either unpainted or painted using adifferent paint or paint system than described herein.

With reference to FIGS. 2-7, the cutting apparatus 100 includes acutting tool 111 and a positioning or mounting tool 120. The cuttingtool 111 includes a power driver 110 and a cutting bit 116.

The power driver 110 includes a housing 112 containing a driver motor115A, and a power supply 115B (schematically illustrated in FIG. 3). Thedrive motor 115A may be an electric, hydraulic, or pneumatic motor, forexample. The power supply 115B may be a battery or a cord or hoseconnection to an electric power source or a pressurized fluid (i.e.,pneumatic or hydraulic). An output shaft 114 (FIG. 7) extends from thehousing 112 and is operably connected to the motor 115A (e.g., viatransmission gearing or directly) to rotatively drive the shaft 114 in arotational direction R (FIG. 4). A chuck 114A is provided on the end ofthe shaft 114.

The cutting bit 116 (FIGS. 6 and 7) is coupled to the shaft 114 by ashaft 116B releasably captured by the chuck 114A. With reference to FIG.6, the cutting bit 116 has a disc-shaped body 116A surrounded by anintegral, annular grinding surface 117. The grinding surface 117includes an annular peripheral section 117A and opposed annular sidesections 117B (FIG. 7).

The cutting bit 116 may be of any suitable construction. According tosome embodiments, the cutting bit is a structured tooth cutter wheel.According to some embodiments, the cutting bit is formed of tungstencarbide and, in some embodiments, is a tungsten carbide structured toothcutting wheel. Suitable cutting bits may include the 9936 StructuredTooth Tungsten Carbide Cutter (Wheel) available from Dremel, a divisionof Robert Bosch Tool Corporation.

The grinding surface 117 has a rounded or arcuate cross-sectionalprofile, as best seen in FIG. 7. In some embodiments, thecross-sectional profile of the grinding surface 117 is truncatedcircular.

With reference to FIG. 2, the mounting tool 120 includes a frame 130.The frame 130 includes a top frame plate 132 and a bottom frame plate134 fixedly joined by a connector plate 136. Upper front trackingrollers 148 are rotatably mounted on the top frame plate 132 andextended forwardly beyond the front edge of the plate 132. Upper frontguide rollers 140 and lower front guide rollers 142 are rotatablymounted on the upper plate 132 and the lower plate 134, respectively. Anupper rear guide roller 144 and a lower rear guide roller 146 arerotatably mounted in slots 156D in the plates 132, 134. Each of therollers 140, 142, 144, 146, 148 rotates about an axis that issubstantially parallel to the axis A-A of the cable 20 when the tool 120is mounted on the cable 20 as described herein.

An upper coupling member in the form of a flexible belt or strap 150extends around and between the rollers 148, 140 and 144 and includes asection 150A extending forwardly from the plate 132 to surroundinglyengage the cable 20. Similarly, a lower coupling member in the form of abelt or strap 152 extends around the rollers 142 and 146 and includes asection 152A extending forwardly of the plate 134 to surroundinglyengage the cable 20. According to some embodiments, the straps 150, 152are formed of fiberglass reinforced neoprene.

A strap adjustment mechanism 156 is provided to selectively adjust thelengths of the strap sections 150A, 152A to cinch or tighten the straps150, 152 about the cable 20 and thereby pull the tracking rollers 148against the cable 20 outer diameter. The adjustment mechanism 156includes a follower 156A mounted on a screw shaft 156B, which isrotatable using a handle 156C. The rollers 144, 146 are coupled to thefollower 156A for movement therewith along the slots 156D. By rotatingthe handle 156C clockwise or counterclockwise, an operator can drive therollers 144, 146 forward or backward and thereby adjust the lengths ofthe strap sections 150A, 152A.

The mounting tool 120 also includes a cutting bit depth adjustmentmechanism 160. As best seen in FIG. 3, the housing 112 of the powerdriver 110 is securely and rigidly mounted in a yoke 162. The yoke 162is in turn affixed to a follower 166. The follower 166 is mounted on ascrew shaft 168 that is journaled in a fixed wall 164. By rotating aknob 169 clockwise or counterclockwise, the operator can drive the yoke162, (and, thereby, the power driver 110 and the cutting bit 116)forward and backward to thereby adjust the position of the cutting bitrelative to the tracking rollers 148 and the front edge of the frame130.

The paint system 180 (FIG. 15) can be used to supply and apply anelectrically conductive coating or paint composition with good adhesiveproperties with respect to the insulation 24. In particular, theconductive paint composition can adhere well to EPR insulation 24.According to some embodiments, the paint system includes a vessel 182Acontaining a supply of an electrically conductive paint 182, a vessel184A containing a supply of a glue 184, an application brush 188, and aroll or strip of masking tape 181. In some embodiments, the paint system180 also includes a vessel 186A containing a supply of a solvent 186.

According to some embodiments of the present invention, one or moresurfaces of the cable 20 can be contacted with an electricallyconductive paint composition. As discussed herein, in some embodiments,the cable 20 is an EPR insulated cable. The term “contacted” andgrammatical variations thereof as used herein in reference to anelectrically conductive paint composition are intended to includepainting, applying, immersing, coating, spraying, rolling, dipping,and/or any variation and/or combination thereof. The electricallyconductive paint composition can provide a smooth transition on the oneor more surfaces to which it is applied. In certain embodiments, anelectrically conductive paint composition is applied to an EPR insulatedcable and provides a smooth transition from the EPR insulated cable'ssemiconductive layer 30 to the EPR insulated cable's insulation layer24.

The electrically conductive paint composition can have desirableadhesive properties to the one or more surfaces to which it is applied.In particular embodiments of the present invention, the electricallyconductive paint composition adheres strongly to the one or moresurfaces to which it is applied.

In particular embodiments of the present invention, the electricallyconductive paint composition comprises, consists essentially of, orconsists of quantities of the electrically conductive paint 182, theglue 184, and, optionally, the solvent 186.

“Electrically conductive paint” as used herein, refers to a paint and/orcoating that comprises, consists essentially of, or consists of anelectrically conductive material and a carrier. The term “electricallyconductive paint” includes a commercially available paint or coating,such as those commercially available from Henkel Acheson™ of MadisonHeights, Mich. under the trademark DAG®. A suitable commerciallyavailable electrically conductive paint includes, but is not limited to,DAG®-T-502 from Henkel Acheson™ of Madison Heights, Mich.

“Electrically conductive material” as used herein, includes any materialable to conduct electricity. Exemplary electrically conductive materialsinclude, but are not limited to semimetals such as graphite, carbon,arsenic, antimony, bismuth, and tin; metals such as silver, gold,platinum, copper, cobalt, iron, aluminum, molybdenum, and nickel; metalalloys; and the like.

The electrically conductive paint 182 can comprise one or moreelectrically conductive materials, which may be the same or different.In certain embodiments of the present invention, the electricallyconductive paint 182 comprises 1, 2, 3, 4, or more electricallyconductive material(s). The electrically conductive material can beprovided in a solid, powder, gel, and/or liquid form. The electricallyconductive material can comprise fibers, flakes, particles includingparticles that have been coated with an electrically conductivematerial, nano-particles, beads, and/or any combination thereof. Incertain embodiments of the present invention, the electricallyconductive material can be present in the electrically conductive paint182 as a dispersion of particles, such as a dispersion of colloidaland/or semi-colloidal particles.

The electrically conductive paint 182 can comprise a carrier, such as,but not limited to, an organic solvent. The electrically conductivepaint 182 can comprise one or more solvents. Exemplary solvents include,but are not limited to, water; alcohols such as methanol, ethanol,isopropanol, and butanol; ketones such as methyl ethyl ketone, methylisobutyl ketone, and N-methyl-2-pyrrolidone; esters, such as, butylacetate; ethers such as alkyl ethers, dialkyl ethers, glycol ethers; andthe like. Further exemplary solvents include those described in U.S.Pat. No. 7,001,947, which is incorporated herein by reference. Inparticular embodiments of the present invention, the solvent is a ketonesuch as methyl ethyl ketone.

According to some embodiments, the electrically conductive paint 182 hasan electrical conductivity of at least about 30 ohms/sq @ 1 mil.Thereby, the electrically conductive paint 182 can provide theelectrically conductive paint composition with an electricalconductivity of at least about 15 ohms/sq @ 1 mil.

The glue 184 in the electrically conductive paint composition can be anyglue or adhesive known to those of skill in the art. In particularembodiments of the present invention, the glue 184 is a cyanoacrylate.“Cyanoacrylate” as used herein, refers generally to a chemical compoundcomprising an acrylate moiety substituted with a cyano group and,optionally, one or more additional functional groups. The electricallyconductive paint composition can comprise one or more cyanoacrylates,which may be the same or different. In certain embodiments of thepresent invention, the electrically conductive paint compositioncomprises 1, 2, 3, 4, or more cyanoacrylate(s). Further, the term“cyanoacrylate” as used herein, includes a commercially availablecyanoacrylate, such as, but not limited to, a cyanoacrylate sold underthe trademark SICOMET® or Loctite®, both commercially available fromHenkel Acheson™ of Madison Heights, Mich. Suitable commercialcyanoacrylates include, but are not limited to, SICOMET® 5023 andLoctite® 406 from Henkel Acheson™ of Madison Heights, Mich.

“Moiety” and “group” are used interchangeably herein to refer to aportion of a molecule, typically having a particular functional orstructural feature, e.g., a linking group (a portion of a moleculeconnecting two other portions of the molecule).

“Substituted” as used herein to describe chemical structures, groups, ormoieties, refers to the structure, group, or moiety comprising one ormore substituents. As used herein, in cases in which a first group is“substituted with” a second group, the second group is attached to thefirst group whereby a moiety of the first group (typically a hydrogen)is replaced by the second group. The substituted group may contain oneor more substituents that may be the same or different.

“Substituent” as used herein references a group that replaces anothergroup in a chemical structure. Typical substituents include nonhydrogenatoms (e.g., halogens), functional groups (such as, but not limited toamino, sulfhydryl, carbonyl, hydroxyl, alkoxy, carboxyl, silyl,silyloxy, phosphate and the like), hydrocarbyl groups, and hydrocarbylgroups substituted with one or more heteroatoms. Exemplary substituentsinclude, but are not limited to, alkyl, lower alkyl, halo, haloalkyl,alkenyl, alkynyl, cycloalkyl, cycloalkylalkyl, heterocyclo,heterocycloalkyl, aryl, arylalkyl, lower alkoxy, thioalkyl, hydroxyl,thio, mercapto, amino, imino, halo, cyano, nitro, nitroso, azido,carboxy, sulfide, sulfone, sulfoxy, phosphoryl, silyl, silylalkyl,silyloxy, boronyl, and modified lower alkyl.

In particular, an “acrylate moiety” as used herein, refers to a compoundrepresented by the following structural formula:

where R is selected from C₁₋₁₈ alkyl, alkoxy, alkoxyalkyl, aryloxy,cycloalkyl, alkenyl, cycloalkenyl, aryl, arylalkyl, arylalkenyl,alkynyl, arylalkynyl, allyl, heterocyclic, silyl, alkylsilyl,alkylsilylalkyl, and haloalkyl groups, each of which may be substitutedwith one or more substituents.

“Cyano” as used herein, refers to a —CN group.

In certain embodiments of the present invention, the term“cyanoacrylate” refers to an alpha cyanoacrylate represented by thefollowing structure:

where R is selected from C₁₋₁₈ alkyl, alkoxy, alkoxyalkyl, aryloxy,cycloalkyl, alkenyl, cycloalkenyl, aryl, arylalkyl, arylalkenyl,alkynyl, arylalkynyl, allyl, heterocyclic, silyl, alkylsilyl,alkylsilylalkyl, and haloalkyl groups, each of which may be substitutedwith one or more substituents. Exemplary alpha cyanoacrylates include,but are not limited, alkyl cyanoacrylates such asmethyl-2-cyanoacrylate, ethyl-2-cyanoacrylate, propyl cyanoacrylates(e.g., n-propyl cyanoacrylate and isopropyl cyanoacrylate), butylcyanoacrylates (e.g., n-butyl cyanoacrylate, isobutyl cyanoacrylate,sec-butyl cyanoacrylate, and tert-butyl cyanoacrylate), and octylcyanoacrylates; cycloalkyl cyanoacrylates such as cyclohexylcyanoacrylate; alkenyl cyanoacrylates such as allyl cyanoacrylate andmethallyl cyanoacrylate; cycloalkenyl cyanoacrylates such ascyclohexenyl cyanoacrylate; alkynyl cyanoacrylates such as propargylcyanoacrylate; aryl cyanoacrylates such as phenyl cyanoacrylate andtoluyl cyanoacrylate; oxygen-containing cyanoacrylates such asmethoxyethyl cyanoacrylate, ethoxyethyl cyanoacrylate, and furfurylcyanoacrylate; silicon atom-containing cyanoacrylates such astrimethylsilylmethyl cyanoacrylate, trimethylsilylethyl cyanoacrylate,trimethylsilylpropyl cyanoacrylate and dimethylvinylsilylmethylalpha-cyanoacrylate; and/or any combination thereof. In particularembodiments, the cyanoacrylate is a C₁₋₈ alkyl alpha cyanoacrylate, suchas, but not limited to, methyl-2-cyanoacrylate or ethyl-2-cyanoacrylate.

“Alkyl” as used herein alone or as part of another group, refers to astraight or branched chain hydrocarbon containing from 1 to 20 carbonatoms. In some embodiments, the alkyl group may contain 1, 2, or 3 up to4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, or 20 carbonatoms. Representative examples of alkyl include, but are not limited to,methyl, ethyl, n-propyl, iso-propyl, n-butyl, sec-butyl, iso-butyl,tert-butyl, n-pentyl, isopentyl, neopentyl, n-hexyl, 3-methylhexyl,2,2-dimethylpentyl, 2,3-dimethylpentyl, n-heptyl, n-octyl, n-nonyl,n-decyl, and the like. “Lower alkyl” as used herein, is a subset ofalkyl and refers to a straight or branched chain hydrocarbon groupcontaining from 1 to 4 carbon atoms. Representative examples of loweralkyl include, but are not limited to, methyl, ethyl, n-propyl,iso-propyl, n-butyl, iso-butyl, tert-butyl, and the like. The term“alkyl” or “loweralkyl” is intended to include both substituted andunsubstituted alkyl or loweralkyl unless otherwise indicated and thesegroups can be substituted with groups such as, but not limited to,polyalkylene oxides (such as PEG), halo (e.g., haloalkyl), alkyl,haloalkyl, alkenyl, alkynyl, cycloalkyl, cycloalkylalkyl, aryl,arylalkyl, heterocyclo, heterocycloalkyl, hydroxyl, alkoxy (therebycreating a polyalkoxy such as polyethylene glycol), alkenyloxy,alkynyloxy, haloalkoxy, cycloalkoxy, cycloalkylalkyloxy, aryloxy,arylalkyloxy, heterocyclooxy, heterocyclolalkyloxy, mercapto,alkenyl-S(O)_(m), haloalkyl-S(O)_(m), alkenyl-S(O)_(m),alkynyl-S(O)_(m), cycloalkyl-S(O)_(m), cycloalkylalkyl-S(O)_(m),aryl-S(O)_(m), arylalkyl-S(O)_(m), heterocyclo-S(O)_(m),heterocycloalkyl-S(O)_(m), amino, carboxy, alkylamino, alkenylamino,alkynylamino, haloalkylamino, cycloalkylamino, cycloalkylalkylamino,arylamino, arylalkylamino, heterocycloamino, heterocycloalkylamino,disubstituted-amino, acylamino, acyloxy, ester, amide, sulfonamide,urea, alkoxyacylamino, aminoacyloxy, nitro or cyano, where m=0, 1, 2 or3.

“Alkenyl” as used herein alone or as part of another group, refers to astraight or branched chain hydrocarbon containing from 1 to 20 carbonatoms (or in loweralkenyl 1 to 4 carbon atoms) which include 1 to 10double bonds in the hydrocarbon chain. In some embodiments, the alkenylgroup may contain 1, 2, or 3 up to 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14,15, 16, 17, 18, 19, or 20 carbon atoms. Representative examples ofalkenyl include, but are not limited to, methylene (═CH₂), vinyl(—CH═CH₂), allyl (—CH₂CH═CH₂), 2-butenyl, 3-butenyl, 4-pentenyl,3-pentenyl, 2-hexenyl, 3-hexenyl, 2,4-heptadiene, and the like. The term“alkenyl” or “loweralkenyl” is intended to include both substituted andunsubstituted alkenyl or loweralkenyl unless otherwise indicated andthese groups can be substituted with groups such as those described inconnection with alkyl and loweralkyl above.

“Alkynyl” as used herein alone or as part of another group, refers to astraight or branched chain hydrocarbon containing from 1 to 20 carbonatoms (or in loweralkynyl 1 to 4 carbon atoms) which include at leastone triple bond in the hydrocarbon chain. In some embodiments, thealkynyl group may contain 2, or 3 up to 4, 5, 6, 7, 8, 9, 10, 11, 12,13, 14, 15, 16, 17, 18, 19, or 20 carbon atoms. Representative examplesof alkynyl include, but are not limited to, 2-propynyl, 3-butynyl,2-butynyl, 4-pentynyl, 3-pentynyl, and the like. The term “alkynyl” or“loweralkynyl” is intended to include both substituted and unsubstitutedalkynyl or loweralkynyl unless otherwise indicated and these groups canbe substituted with the same groups as set forth in connection withalkyl and loweralkyl above.

“Cycloalkyl” as used herein alone or as part of another group, refers toa saturated or partially unsaturated cyclic hydrocarbon group containingfrom 3, 4 or 5 to 6, 7 or 8 carbons (which carbons may be replaced in aheterocyclic group as discussed below). Representative examples ofcycloalkyl include, cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl,cycloheptyl, and cyclooctyl. These rings may be optionally substitutedwith additional substituents as described herein such as halo orloweralkyl. The term “cycloalkyl” is generic and intended to includeheterocyclic groups as discussed below unless specified otherwise.

“Aryl” as used herein alone or as part of another group, refers to amonocyclic carbocyclic ring system or a bicyclic carbocyclic fused ringsystem or higher having one or more aromatic rings. Representativeexamples of aryl include, azulenyl, indanyl, indenyl, naphthyl, phenyl,tetrahydronaphthyl, and the like. The term “aryl” is intended to includeboth substituted and unsubstituted aryl unless otherwise indicated andthese groups may be substituted with the same groups as set forth inconnection with alkyl and loweralkyl above.

“Arylalkyl” as used herein alone or as part of another group, refers toan aryl group, as defined herein, appended to the parent molecularmoiety through an alkyl group, as defined herein. Representativeexamples of arylalkyl include, but are not limited to, benzyl,2-phenylethyl, 3-phenylpropyl, 2-naphth-2-ylethyl, and the like.

“Arylalkenyl” as used herein alone or as part of another group, refersto an aryl group, as defined herein, appended to the parent molecularmoiety through an alkenyl group, as defined herein.

“Arylalkynyl” as used herein alone or as part of another group, refersto an aryl group, as defined herein, appended to the parent molecularmoiety through an alkynyl group, as defined herein.

“Heterocyclic group” or “heterocyclo” as used herein alone or as part ofanother group, refers to an aliphatic (e.g., fully or partiallysaturated heterocyclo) or aromatic (e.g., heteroaryl) monocyclic- or abicyclic-ring system. Monocyclic ring systems are exemplified by any 5or 6 membered ring containing 1, 2, 3, or 4 heteroatoms independentlyselected from oxygen, nitrogen and sulfur. The 5 membered ring has from0-2 double bonds and the 6 membered ring has from 0-3 double bonds.Representative examples of monocyclic ring systems include, but are notlimited to, azetidine, azepine, aziridine, diazepine, 1,3-dioxolane,dioxane, dithiane, furan, imidazole, imidazoline, imidazolidine,isothiazole, isothiazoline, isothiazolidine, isoxazole, isoxazoline,isoxazolidine, morpholine, oxadiazole, oxadiazoline, oxadiazolidine,oxazole, oxazoline, oxazolidine, piperazine, piperidine, pyran,pyrazine, pyrazole, pyrazoline, pyrazolidine, pyridine, pyrimidine,pyridazine, pyrrole, pyrroline, pyrrolidine, tetrahydrofuran,tetrahydrothiophene, tetrazine, tetrazole, thiadiazole, thiadiazoline,thiadiazolidine, thiazole, thiazoline, thiazolidine, thiophene,thiomorpholine, thiomorpholine sulfone, thiopyran, triazine, triazole,trithiane, and the like. Bicyclic ring systems are exemplified by any ofthe above monocyclic ring systems fused to an aryl group as definedherein, a cycloalkyl group as defined herein, or another monocyclic ringsystem as defined herein. Representative examples of bicyclic ringsystems include but are not limited to, for example, benzimidazole,benzothiazole, benzothiadiazole, benzothiophene, benzoxadiazole,benzoxazole, benzofuran, benzopyran, benzothiopyran, benzodioxine,1,3-benzodioxole, cinnoline, indazole, indole, indoline, indolizine,naphthyridine, isobenzofuran, isobenzothiophene, isoindole, isoindoline,isoquinoline, phthalazine, purine, pyranopyridine, quinoline,quinolizine, quinoxaline, quinazoline, tetrahydroisoquinoline,tetrahydroquinoline, thiopyranopyridine, and the like. Theseheterocyclic rings include quaternized derivatives thereof and may beoptionally substituted with groups such as, but not limited to, halo,alkyl, haloalkyl, alkenyl, alkynyl, cycloalkyl, cycloalkylalkyl, aryl,arylalkyl, heterocyclo, heterocycloalkyl, hydroxyl, alkoxy, alkenyloxy,alkynyloxy, haloalkoxy, cycloalkoxy, cycloalkylalkyloxy, aryloxy,arylalkyloxy, heterocyclooxy, heterocyclolalkyloxy, mercapto,alkyl-S(O)_(m), haloalkyl-S(O)_(m), alkenyl-S(O)_(m), alkynyl-S(O)_(m),cycloalkyl-S(O)_(m), cycloalkylalkyl-S(O)_(m), aryl-S(O)_(m),arylalkyl-S(O)_(m), heterocyclo-S(O)_(m), heterocycloalkyl-S(O)_(m),amino, alkylamino, alkenylamino, alkynylamino, haloalkylamino,cycloalkylamino, cycloalkylalkylamino, arylamino, arylalkylamino,heterocycloamino, heterocycloalkylamino, disubstituted-amino, acylamino,acyloxy, ester, amide, sulfonamide, urea, alkoxyacylamino, aminoacyloxy,nitro or cyano where m=0, 1, 2 or 3.

“Alkoxy” as used herein alone or as part of another group, refers to analkyl or loweralkyl group, as defined herein (and thus includessubstituted versions such as polyalkoxy), and is appended to the parentmolecular moiety through an oxy group, —O—. Representative examples ofalkoxy include, but are not limited to, methoxy, ethoxy, propoxy,2-propoxy, butoxy, tert-butoxy, pentyloxy, hexyloxy and the like.

“Aryloxy” as used herein alone or as part of another group, refers to anaryl group, as defined herein (and thus includes substituted versions),and is appended to the parent molecular moiety through an oxy group,—O—.

“Halo” as used herein, refers to any suitable halogen, including F, Cl,Br and I.

“Oxo” as used herein, refers to a —O— moiety.

“Oxy” as used herein, refers to a —O— moiety.

“Thio” as used herein, refers to a —S— moiety.

“Silyl” as used herein, refers to a group comprising one or more siliconatoms (Si), such as but not limited to, a group of the formula—SiR^(a)R^(b)R^(c), wherein R^(a), R^(b), and R^(c) are any suitableindependently selected hydrocarbyl group, such as alkyl, aryl,alkylaryl, etc. Examples of silyl groups include, but are not limitedto, trimethyl silyl, tert-butyl dimethyl silyl, etc.

“Amine” or “amino group” is intended to mean the radical —NH2.

“Alkylamino” is intended to mean the radical —NHR′, where R′ is alkyl.

“Dialkylamino” is intended to mean the radical NR′R″, where R′ R″ areeach independently an alkyl group.

“Aminoalkyl” refers to an alkyl substituent which is further substitutedwith one or more amino groups.

The cyanoacrylate (i.e., of the glue 184) can be in monomeric and/orpolymeric form. Typically, the cyanoacrylate is in monomeric form priorto being applied to one or more surfaces of the cable 20. However,before and/or during application of the electrically conductive paintcomposition to the one or more surfaces of the cable 20, thecyanoacrylate can polymerize. In certain embodiments, during and/orafter application of the electrically conductive paint composition tothe one or more surfaces of the cable 20 (e.g., the semiconductive layer30 and the EPR insulation layer 24), the cyanoacrylate polymerizes.

The cyanoacrylate can be in solid, powder, gel, and/or liquid form. Thecyanoacrylate can be present in the electrically conductive paintcomposition in an amount of about 0.1% to about 35% by weight of theelectrically conductive paint composition or any range therein, such asbetween about 0.5% to about 20% or between about 1% to about 15% byweight of the electrically conductive paint composition.

The cyanoacrylate can have a set time of between about 2 seconds toabout 10 minutes or any range therein, such as between about 5 secondsto about 5 minutes, between about 5 seconds to about 1 minute, orbetween about 10 seconds to about 30 seconds. In certain embodiments,the cyanoacrylate has a set time of between about 10 seconds to about 1minute. “Set time” as used herein, refers to the amount of time it takesfor a cyanoacrylate to convert to a fixed and/or hardened state. Thus,after the set time, the cyanoacrylate can no longer be applied to one ormore surfaces of the cable 20. The cyanoacrylate can continue to curefor about 36 hours or more after the set time.

The cyanoacrylate, when present in the form of a gel or liquid, can havea low to medium viscosity, such as a viscosity between about 1 mPa·s toabout 1,000 mPa·s at 25° C. or any range therein, such as between about1 mPa·s to about 800 mPa·s, between about 4 mPa·s to about 500 mPa·s,between about 10 mPa·s to about 50 mPa·s, or between about 20 mPa·s toabout 100 mPa·s at 25° C.

In certain embodiments of the present invention, the glue 184, such as acyanoacrylate, is separate from the electrically conductive paint 182until immediately before application of the electrically conductivepaint composition. The electrically conductive paint composition can beprepared by combining, mixing, shaking, and/or stirring the glue 184 andthe electrically conductive paint 182. The ratio of the electricallyconductive paint 182 to the glue 184, such as a cyanoacrylate, can bebetween about 10:3 to about 15:3 or any range therein. In certainembodiments of the present invention, the ratio of the electricallyconductive paint 182 and the glue 184 is about 10:3, 11:3, 12:3, 13:3,14:3, or 15:3. In certain embodiments of the present invention, theelectrically conductive paint composition comprises a commerciallyavailable electrically conductive paint and a commercially availablecyanoacrylate.

The electrically conductive paint composition can have a set time ofbetween about 5 seconds to about 15 minutes or any range therein, suchas between about 5 seconds to about 12 minutes, between about 10 secondsto about 7 minutes, between about 10 seconds to about 5 minutes, orbetween about 10 seconds to about 1 minute. In certain embodiments, theelectrically conductive paint composition has a set time of betweenabout 10 seconds to about 5 minutes. “Set time” as used herein, refersto the amount of time it takes for an electrically conductive paintcomposition to convert to a fixed and/or hardened state. Thus, after theset time, the electrically conductive paint composition can no longer beapplied to one or more surfaces of the cable 20. The electricallyconductive paint composition can continue to cure for about 48 hours ormore after the set time.

The electrically conductive paint composition can optionally compriseone or more solvent(s) 186. Exemplary solvents include, but are notlimited to, water; alcohols such as methanol, ethanol, isopropanol, andbutanol; ketones such as methyl ethyl ketone, methyl isobutyl ketone,and N-methyl-2-pyrrolidone; esters, such as, butyl acetate; ethers suchas alkyl ethers, dialkyl ethers, glycol ethers; and the like. Furtherexemplary solvents include those described in U.S. Pat. No. 7,001,947,which is incorporated herein by reference. In particular embodiments ofthe present invention, the solvent is a ketone such as methyl ethylketone.

In certain embodiments of the present invention, the electricallyconductive paint composition can further comprise one or more solvent(s)186. According to some embodiments, the one or more solvent(s) 186 canbe added to the electrically conductive paint 182 and/or glue 184before, during, and/or after the glue 184 and the electricallyconductive paint 182 are combined. In some embodiments of the presentinvention, the one or more solvent(s) 186 is added to the electricallyconductive paint 182 before the glue 184 is combined with theelectrically conductive paint 182.

The one or more solvent(s) 186, in some embodiments, can be added to theelectrically conductive paint composition to increase the set time ofthe electrically conductive paint composition. In particular embodimentsof the present invention, by adding one or more solvent(s) 186 to theelectrically conductive paint composition, the set time of theelectrically conductive paint composition can be increased by betweenabout 2 seconds to about 15 minutes or any range therein, such asbetween about 5 seconds and 10 minutes, between about 10 seconds and 5minutes, or between about 20 seconds and 2 minutes. In other embodimentsof the present invention, the one or more solvent(s) 186 can be added tothe electrically conductive paint composition to increase the viscosityof the electrically conductive paint composition and/or to increaseand/or improve the solubility of the glue 184 in the electricallyconductive paint composition.

The electrically conductive paint composition can further compriseadditives known to those skilled in the art. Such additives include, butare not limited to, stabilizers, accelerators, plasticizers, fillers,opacifiers, thickeners, viscosity modifiers, inhibitors, thixotrophyconferring agents, dyes, thermal degradation enhancers, combinationsthereof, and the like, such as those described in U.S. Pat. No.6,833,196, which is incorporated herein by reference.

The tape 181 may be any suitable tape. According to some embodiments,the tape 181 is a self-adhesive PTFE tape.

The cable preparation system may be used as follows in accordance withembodiments of the invention to prepare the cable 20.

An end section of the cable jacket 28 is cut away to expose thesemiconductive layer 30. The jacket 28 may be removed in any suitablemanner such as by cutting the jacket circumferentially and axially andstripping. The neutral conductors 26 and any other screen wires, tapes,lead sheath, corrugated sheath, bedding tapes or the like may be bentback or removed as desired to expose the semiconductive layer 30 asshown in FIGS. 2-5 and 8.

With reference to FIGS. 2-5, with the yoke 162 retracted (so that thebit 116 is radially spaced apart from the cable 20 as shown in FIG. 2),the straps 150, 152 are looped over the cable 20 and the cuttingapparatus 100 is axially positioned along the length of the cable 20 toposition the cutting bit 116 adjacent the location where the operatorintends to terminate the semiconductive layer 30. The strap adjustmenthandle 156C is rotated to tighten the straps 150, 152 and draw the plate134 and the tracking rollers 148 snugly against the exposedsemiconductive layer 30.

Optionally, stop devices may be used to limit or prevent movement ormigration of the mounting tool 120 axially along the length of the cable20 before or during execution of the grinding step. For example, a pairof spring clamps 153 may be secured about the circumference of the cable20 immediately above the strap section 150A and immediately below thestrap section 152A, respectively.

The power driver 110 is actuated to rotate the cutting bit 116 in arotation direction R as shown in FIG. 4. The rotation direction R istransverse to and, according to some embodiments, perpendicular to, thecircumference of the cable 20 (and thus, transverse or perpendicular tothe dividing groove 40 to be formed in the semiconductive layer 30).That is, the rotation of the bit 116 or grinding surface 117 defines abit plane M-M (FIGS. 4 and 7) that is orthogonal to a groove plane N-N(FIGS. 5 and 7) defined by the circumferential groove 40 in thesemiconductive layer 30. According to some embodiments, the axis ofrotation V-V (FIG. 7) of the grinding surface 117 is transverse to, andin some embodiments, perpendicular to the cable axis A-A). The rotationdirection R is also selected such that the portion of the grindingsurface 117 facing (i.e., most proximate) the semiconductive layer 30rotates in a direction from the inner end of the cable 20 (i.e., the endon which the semiconductive layer 30 is to be retained) to the outer orterminal end of the cable 20 (i.e., the end from which thesemiconductive layer 30 is to be removed.

According to some embodiments, the bit 116 is rotated at a rate in therange of from about 10000 to 33000 RPM.

With the bit 116 being rotated, the operator rotates the adjustor knob169 to slide the yoke 162 toward the cable 20 and to thereby drive thegrinding surface 117 radially (with respect to the cable) into thesemiconductive layer 30. The grinding surface 117 grinds away a notch orslot in the semiconductive layer 30. The direction of rotation R of thegrinding surface 117 is such that the portion of the grinding surface117 engaging the semiconductive layer 30 travels or rotates axially awayfrom the portion of the semiconductive layer 30 to be retained on thecable 20.

The operator then pivots or rotates the cutting apparatus 100 in acircumferential pivot direction P (FIGS. 5 and 7) about thecircumference of the cable 20 with the straps 150, 152 still engaged andthe bit 116 still being driven in the direction R. As the cuttingapparatus 100 is so pivoted, the grinding surface side portion 117Bgrinds away the encountered material of the semiconductive layer 30 tothereby for an elongate circumferential groove 41 as shown in FIG. 7.The tracking rollers 148 facilitate smooth and nonbinding pivoting ofthe mounting tool 120 about the cable 20 while maintaining a uniformspacing between the yoke 162 and the semiconductive layer 30 and therebya uniform depth of the grinding surface 117 into the semiconductivelayer 30. The cutting tool 100 is pivoted about the cable 20 a fullrevolution (i.e., about 360 degrees) so that a full annularcircumferential groove is formed in the semiconductive layer 30.

According to some embodiments, multiple, axially coincident,progressively deeper circumferential grooves are formed in thesemiconductive layer 30 as described above. That is, a first orpreliminary circumferential groove is formed to a first depth, the depthadjustment mechanism 160 is used to set the bit 116 at a second, deeperdepth, the cutting tool 100 is pivoted around the cable 20 to form asecond, deeper annular circumferential groove at the same axial locationalong the cable 20, and so forth, until the desired ultimate depth isreached. According to some embodiments, at least three such passes areexecuted to form progressively deeper grooves.

An exemplary ultimate, final or completed dividing groove 40 is shown inFIGS. 2-5 and 9. After the groove 40 is completed, the bit 116 isretracted using the depth adjustment mechanism 160 and the strapadjustment mechanism 156 is actuated to loosen the straps 150, 160, andthe cutting tool 100 is removed from the cable.

Due to the round or circular profile of the grinding surface 117 of thebit 116, the groove 40 has opposed chamfered sidewalls 42 and 44 asshown in FIGS. 2 and 10. An annular circumferential section of thesemiconductive layer 30 has been fully removed by the bit 116 so that anannular segment 24A of the insulation 24 is exposed between opposed,spaced apart terminal edges 46A and 46B of the now fully severedsemiconductive layer 30. A gap 48 is defined between the edges 46A, 46B.The sidewall 42 is arcuately tapered in an axial direction toward theterminal edge 46A.

The semiconductive layer 30 is effectively divided into a retainedsection 30A and a waste section 30B by the groove 40 (FIG. 9). Agenerally axially extending slit C (FIG. 9) may be formed in the section30B and the section 30B peeled away to expose the insulation 24 as shownin FIG. 11. Notably, the chamfered sidewall 42 remains to smoothlytransition the profile of the semiconductive layer section 30A from itsouter diameter to the terminal edge 46A interfacing the beginning of theexposed insulation 24. A grinding cloth or other sanding or polishingdevice may be used to smooth the upper corner of the chamfered side wall42.

According to some embodiments, the depth D (FIG. 10) of the groove 40 isin the range of from about 0.5 mm to 2.5 mm. According to someembodiments, the depth D is substantially the same as the thickness T1of the semiconductive layer 30.

According to some embodiments, the width W1 (FIG. 10) of the groove 40is between about 8 mm and 15 mm. According to some embodiments, thewidth W2 (FIG. 10) of the chamfered sidewall 42 is between about 3 mmand 7 mm. According to some embodiments, the width W3 (FIG. 10) of thegap 48 is between about 0.1 mm and 5 mm.

According to some embodiments, the ratio of the width W2 to the depth Dis at least 1 and, according to some embodiments, is between about 1 and2.

According to some embodiments, the thickness T2 (FIG. 10) of thesemiconductive layer terminal edge 46A substantially merges with theouter diameter of the insulation 24.

The masking tape 181 is wrapped circumferentially about the insulation24 a selected axial distance from the terminal edge 46A, as shown inFIG. 12. The location of the tape 181 corresponds to the intendedterminal end of the effective semiconductive layer.

The paint 182 is then shaken in the vessel 182A on-site and in thevicinity of the cable 20. The glue 184 is added to the paint 182 in thevessel 182A and the mixture is shaken to form the electricallyconductive paint composition. According to some embodiments, the mixtureis shaken from about 5 to 10 seconds. The solvent 186 may also be mixedin with the paint 182 and the glue 184 to extend the curing time.

The conductive paint composition is then applied or painted onto theinsulation 24 and a section 30C of the semiconductive layer section 30Ausing the brush 188 to form a paint coat or layer 190 (FIGS. 12 and 13).According to some embodiments, the paint composition is applied startingfrom the end adjacent the tape 181 to the end overlapping the section30C so that the layer 190 is thinner on the tape 181 end (i.e., athickness gradient is provided from end to end). A portion 190A of thepaint layer 190 surrounds the insulation 24 and a portion 190B of thepaint layer 190 surrounds the semiconductive layer section 30C.

After the paint layer 190 has cured, the tape 181 can be removed.According to some embodiments, the set time for the conductive paintcomposition is less than about 5 minutes and the electrically conductivepaint composition is applied to the insulation 24 within 1 minute of thestep of mixing the paint 182 and the glue 184.

Desired cable accessories can thereafter be installed on the preparedcable. According to some embodiments, the stress cone 60 is installed onthe cable 20 around the terminal edge 46A and the paint layer 190.

The methods and apparatus as disclosed herein can provide significantadvantages.

The cutting methods and cutting apparatus 100 can ease the preparationof polymer insulated cables, particular EPR cables, on-site for theinstallation of cable accessories. The chamfered sidewall 42 provides asmooth transition from the outer diameter of the semiconductive layer 30to the outer diameter of the insulation 24 for a conforming cableaccessory (e.g., the stress cone 60) surrounding the cable 20. The useof a rotating cutting bit 116 to grind away the semiconductive layer 30and the cutting apparatus 100 can prevent, limit or reduce the risk of athin layer of the semiconductive layer 30 to be retained on the cable 20being lifted off of or delaminating from the insulation 24.

The mounting tool 120 can facilitate the accurate, reliable, consistentand convenient formation of the groove 40 and the chamfered sidewall 42.The cutting apparatus 100 can be selectively adjusted to fit cables ofdifferent diameters. The cutting apparatus 100 can be selectivelyadjusted to properly form severing grooves in cables havingsemiconductive layers 30 of different thicknesses.

The tungsten carbide cutting bit 116 generates relatively low heat whengrinding, thereby reducing or eliminating the risk of damaging ordistorting the semiconductive layer 30.

The paint system 180 reduces the sensitivity of the painted conductivelayer 190 by improving the bonding between the paint and the EPR cableinsulation 24. The conductive paint layer 190 provides a very smalltransition step between the effective semiconductive layer (i.e., thesemiconductive layer 30 effectively extended by the paint layer 190),and thereby provides a smoother profile for an overlying cable accessorysuch as the stress cone 60. The relatively quick curing time (andadjustability thereof) provides a short wait for curing of the paintlayer, which can speed the installation procedure and reduce the riskthat a cable accessory will be installed before the paint layer issufficiently cured and will damage the paint layer.

According to some embodiments, the length L1 (FIG. 13) of the paintlayer portion 190A is between about 10 mm and 30 mm. According to someembodiments, the length L2 of the paint layer portion 190B is betweenabout 5 mm and 20 mm.

According to some embodiments, the thickness T3 (FIG. 13) of the paintlayer 190 at the end distal from the semiconductive layer 30 is in therange of from about 0.05 mm to 0.5 mm.

According to some embodiments, the cutting apparatus 100 and the paintsystem 180 are provided as a pre-combined kit for an installer.According to some embodiments, the paint system 180 is provided as apre-combined kit without the cutting apparatus 100.

The foregoing is illustrative of the present invention and is not to beconstrued as limiting thereof. Although a few exemplary embodiments ofthis invention have been described, those skilled in the art willreadily appreciate that many modifications are possible in the exemplaryembodiments without materially departing from the novel teachings andadvantages of this invention. Accordingly, all such modifications areintended to be included within the scope of this invention. Therefore,it is to be understood that the foregoing is illustrative of the presentinvention and is not to be construed as limited to the specificembodiments disclosed, and that modifications to the disclosedembodiments, as well as other embodiments, are intended to be includedwithin the scope of the invention.

1. A method for preparing a polymer insulated cable including asemiconductive layer surrounding a polymeric insulation layer, and acable jacket surrounding the semiconductive layer, the methodcomprising: cutting away an end section of the cable jacket to exposethe semiconductive layer; thereafter cutting the semiconductive layer bygrinding a circumferential dividing groove in the semiconductive layerusing a rotating grinding surface, wherein the dividing groove definesfirst and second semiconductive sections of the semiconductive layer onopposed sides of the dividing groove; and thereafter removing the secondsemiconductive section from the polymeric insulation layer whileretaining the first semiconductive section on the polymeric insulationlayer.
 2. The method of claim 1 wherein the insulation layer is formedof ethylene propylene rubber (EPR).
 3. The method of claim 1 includingrotating the grinding surface circumferentially around the cable whilerotating the grinding surface in contact with the semiconductive layer.4.-7. (canceled)
 8. The method of claim 1 wherein the grinding surfaceis formed of tungsten carbide.
 9. The method of claim 1 includingrotating the grinding surface using a power driver.
 10. The method ofclaim 9 including releasably coupling the power driver and the grindingsurface to the cable using a mounting tool.
 11. The method of claim 1including: cutting a circumferential preliminary groove in thesemiconductive layer using the rotating grinding surface at an axialposition along the cable, the preliminary groove having a first depth;and thereafter cutting the dividing groove into the semiconductive layerwithin the preliminary groove at the axial position.
 12. The method ofclaim 1 wherein the dividing groove extends fully through thesemiconductive layer so that a segment of the polymeric insulation layeris exposed between the first and second semiconductive sections andthrough the dividing groove. 13.-58. (canceled)
 59. A method forpreparing a polymer insulated cable including a semiconductive layersurrounding a polymeric insulation layer, the method comprising: cuttinga circumferential preliminary groove in the semiconductive layer using arotating grinding surface at an axial position along the cable, thepreliminary groove having a first depth; thereafter cutting thesemiconductive layer by grinding a circumferential dividing groove inthe semiconductive layer within the preliminary groove at the axialposition using the rotating grinding surface, wherein the dividinggroove defines first and second semiconductive sections of thesemiconductive layer on opposed sides of the dividing groove; andthereafter removing the second semiconductive section from the polymericinsulation layer while retaining the first semiconductive section on thepolymeric insulation layer.
 60. A method for preparing a polymerinsulated cable including a semiconductive layer surrounding a polymericinsulation layer, the method comprising: cutting the semiconductivelayer by grinding a circumferential dividing groove in thesemiconductive layer using a rotating grinding surface, wherein thedividing groove defines first and second semiconductive sections of thesemiconductive layer on opposed sides of the dividing groove; andthereafter removing the second semiconductive section from the polymericinsulation layer while retaining the first semiconductive section on thepolymeric insulation layer; wherein the dividing groove extends fullythrough the semiconductive layer so that a segment of the polymericinsulation layer is exposed between the first and second semiconductivesections and through the dividing groove.